International Conference on Thermal, Mechanical and Multiphysics Engineering
(ICTMME-25)

2nd - 3rd May 2025,
George Town, Malaysia

Quality articles will be published in well reputed journals like Scopus Indexed or Web of Science **

Pre-Enrollment

2nd April 2025

Final Paper Submission

17th April`2025

Registration Deadline

17th April`2025

Conference Date

2nd - 3rd May 2025,

Call For Paper

Thermal, Mechanical and Multiphysics
Simulation and Experiments
in Micro/Nanoelectronics and Systems
Multi-physics simulation (thermal, mechanical, thermo-
mechanical, coupled thermo-fluidic, coupled electro-mechanics,
fluid structure interactions, opto-mechanics)
Failure analysis and failure mode extraction
Material characterisation, experiments and modelling
Validation of simulations by experiments
Failure criteria and damage modelling for reliability prediction
Integrated process modelling
Advanced numerical and analytical simulation methodologies
and tools
Behavioural modelling
Simulation-based optimisation, virtual prototyping in product
and/or process design
Compact modelling and model order reduction
Multiscale modeling and simulation
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems