Call for Papers
The International Conference on Electronics Packaging and Assembly Engineering invites researchers, academicians, industry experts, and practitioners to submit original and high-quality research contributions. This conference serves as a global platform for presenting innovative ideas, exchanging knowledge, and fostering interdisciplinary collaboration.
Focusing on key research areas such as Electrical and Electronics Engineering, the conference aims to bridge theoretical advancements with real-world applications.
Authors are invited to submit papers addressing, but not limited to, the following areas:
All submissions undergo a rigorous peer-review process conducted by subject matter experts to ensure originality and technical quality. Accepted papers will be considered for publication in reputed journals and conference proceedings.
Conference Registration
To confirm your participation and secure your presentation slot, authors of accepted papers must complete the registration. Early registration is highly recommended to enjoy discounted fees.
Register Now to Confirm ParticipationPublication & Submission
Present your findings to a global audience. All accepted papers are eligible for publication in ISER-affiliated journals and conference proceedings, providing you with maximum academic visibility.
Submit Your Paper for Review