Pre-Enrollment

21st November 2026

Final Paper Submission

26th November 2026

Registration Deadline

6th December`2026

Conference Date

21st Dec - 22nd Dec 2026

Call for Papers

The International Conference on Thin Films Engineering and Materials Applications invites researchers, academicians, industry experts, and practitioners to submit original and high-quality research contributions. This conference serves as a global platform for presenting innovative ideas, exchanging knowledge, and fostering interdisciplinary collaboration.

Focusing on key research areas such as Materials Engineering, the conference aims to bridge theoretical advancements with real-world applications.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Advancements In Thin Film Deposition Techniques
02
Characterization Methods For Thin Films
03
Applications Of Thin Films In Electronics
04
Thin Films In Renewable Energy Systems
05
Nanostructured Thin Films For Sensors
06
Optical Properties Of Thin Film Materials
07
Thin Films For Protective Coatings
08
Flexible Thin Film Technologies
09
Thin Films In Biomedical Applications
10
Thin Film Materials For Photonics
11
Challenges In Thin Film Fabrication
12
Thin Films In Energy Storage Devices
13
Surface Engineering Of Thin Films
14
Thin Films For Corrosion Resistance
15
Thin Film Transistors: Current Trends
16
Integration Of Thin Films In Devices
17
Thin Films For Thermal Management
18
Emerging Materials For Thin Film Applications
19
Thin Film Technologies For Aerospace
20
Future Directions In Thin Film Research
Conference Registration

To confirm your participation and secure your presentation slot, authors of accepted papers must complete the registration. Early registration is highly recommended to enjoy discounted fees.

Register Now to Confirm Participation
Publication & Submission

Present your findings to a global audience. All accepted papers are eligible for publication in ISER-affiliated journals and conference proceedings, providing you with maximum academic visibility.

Submit Your Paper for Review