Pre-Enrollment

8th November 2026

Final Paper Submission

13th November 2026

Registration Deadline

23rd November`2026

Conference Date

8th Dec - 9th Dec 2026

Call for Papers

The International Conference on Thermal Management in Electronics and Microdevices invites researchers, academicians, industry experts, and practitioners to submit original and high-quality research contributions. This conference serves as a global platform for presenting innovative ideas, exchanging knowledge, and fostering interdisciplinary collaboration.

Focusing on key research areas such as Heat Transfer, the conference aims to bridge theoretical advancements with real-world applications.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Thermal Management In Microdevices
02
Heat Dissipation Techniques In Electronics
03
Innovative Cooling Solutions For Devices
04
Thermal Interface Materials And Applications
05
Thermal Performance Of Electronic Components
06
Modeling Thermal Behavior In Microdevices
07
Heat Transfer In Semiconductor Devices
08
Thermal Cycling Effects On Electronics
09
Nano-coatings For Thermal Management
10
Thermal Management In Wearable Technology
11
Heat Sinks Design And Optimization
12
Thermal Simulations For Electronic Systems
13
Thermal Energy Storage In Microdevices
14
Smart Thermal Management Systems
15
Thermal Challenges In Iot Devices
16
Heat Transfer In High-density Packaging
17
Thermal Reliability Of Electronic Systems
18
Cooling Strategies For High-performance Computing
19
Thermal Effects On Battery Performance
20
Emerging Trends In Thermal Management
Conference Registration

To confirm your participation and secure your presentation slot, authors of accepted papers must complete the registration. Early registration is highly recommended to enjoy discounted fees.

Register Now to Confirm Participation
Publication & Submission

Present your findings to a global audience. All accepted papers are eligible for publication in ISER-affiliated journals and conference proceedings, providing you with maximum academic visibility.

Submit Your Paper for Review